MEMS Fabrication Methods……………………………………………………….. 17
3.1 Photolithography…………………………………………………………………
17
3.2 Materials
for
Micromachining……………………………………………………18
3.2.1 Substrates…………………………………………………………………………
18
3.2.2 Additive Films and Materials……………………………………………………..
19
3.3 Bulk
Micromachining…………………………………………………………….20
3.3.1 Wet
Etching……………………………………………………………………….
20
3.3.2 Dry
Etching……………………………………………………………………….
21
3.4 Surface
Micromachining…………………………………………………………
21
3.4.1 Fusion
Bonding……………………………………………………………………
23
3.5 High-Aspect-Ratio-Micromachining……………………………………………. 23
3.5.1 LIGA……………………………………………………………………………...
23
3.5.2 Laser
Micromachining……………………………………………………………
24
3.6 Computer Aided Design………………………………………………………….24
3.7 Assembly and System Integration……………………………………………….. 25
3.8 Packaging………………………………………………………………………...
27
3.8.1 Multi-Chip
Modules………………………………………………………………
28
3.8.2 Passivation and Encapsulation……………………………………………………
29
3.9 Foundry
Services…………………………………………………………………29
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