An Introduction to mems (Micro-electromechanical Systems)

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A significant improvement in device functionality and a high level of integration can be 

Benefits of trench integration include smaller, faster, less costly, lower power and higher 

sensitivity integrated systems.  There are no real trade-offs with the technology except the 

potential for more parasitic noise from interconnects on the chip. 

 

3.8  Packaging 

The proper operation of MEMS devices depends critically upon the ‘clean’ environment 

provided by the package and is considered an enabler for the commercialisation of MEMS.  

Packaging of microsensors presents special problems as part of the sensor requires 

environmental access while the rest may require protection from environmental conditions 

and handling (Figure 28). 

Figure 28.  Schematic illustration of the packaging role of a MEMS microsensor [32]. 

Although there is no generic package for a MEMS device, the package should: 

•

  provide protection and be robust enough to withstand its operating environment 

  allow for environmental access and connections to physical domain (optical fibres, 

fluid feed lines etc.) 

•

  minimize electrical interference effects from inside and outside the device 

  dissipate generated heat and withstand high operating temperatures (where necessary) 

•

  minimize stress from external loading 

  handle power from electrical connection leads without signal disruption 

Figure 27.  Integrated MEMS/IC (iMEMS) technology developed at 

Sandia National Laboratories for the monolithic integration of IC control 

circuits and MEMS sensors and actuators on the same silicon chip.  To 

handle the differences in surface topography, the MEMS components are 

fabricated in a shallow trench below the wafer surface prior to IC 

processing [2]. 

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