Additive Films and Materials

possible substrates and includes conductors, semiconductors and insulators such as: 

•

  silicon - single crystal, polycrystalline and amorphous 

  silicon compounds (Si

x

N

y

2

, SiC etc.) 

  metals and metallic compounds (Au, Cu, Al, ZnO, GaAs, IrO

x

, CdS) 

  ceramics (Al

2

0

3 

•

  organics (diamond, polymers, enzymes, antibodies, DNA etc.) [4] 

An Introduction to MEMS 

 

 

Prime Faraday Technology Watch – January 2002 

20

 

3.3  Bulk Micromachining 

 

Bulk micromachining involves the removal of part of the bulk substrate.  It is a subtractive 

process that uses wet anisotropic etching or a dry etching method such as reactive ion etching 

(RIE), to create large pits, grooves and channels.  Materials typically used for wet etching 

include silicon and quartz, while dry etching is typically used with silicon, metals, plastics 

and ceramics. 

 

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