| 3.8.1 Multi-chip Modules
Multi-chip modules (MCMs) enable the integration and packaging of MEMS devices on a
single substrate using traditional thick-film technology. Using ceramics, silicon and printed
circuit board laminates as substrate materials, a variety of die types can be attached to, or
embedded within, the substrate surface. The dies can be interconnected by wire bonds, flip
chips or direct metallisation. The close proximity of each die allows for improved system
performance by providing low-noise wiring and in some cases eliminating unnecessary
interconnections. Three-dimensional variations of this technology are emerging in which dies
and their holding substrates are stacked up on top of each other.
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