3.7 Assembly and System Integration
The MEMS fabrication process essentially uses the same process as the microelectronics
industry as shown in Figure 25.
Figure 25. Similarities between IC and MEMS microfabrication processes [3].
Despite the fact that MEMS uses some of the same tools as those used with ICs, the greatest
challenge facing the MEMS industry is system integration between the miniature mechanical
systems and the electronic interface. For the cost-effective production of MEMS devices it is
necessary to combine complex mechanical structures together with microelectronics to form
integrated mechanical and electrical systems on a single chip that can be batch fabricated with
high yield and no additional or subsequent assembly (Figure 26).
Figure 26. Integration of mechanical structures and microelectronics [2].
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